TECHNOLOGY JUNE 2016 89 The premium smartphone Galaxy S7 and the Galaxy A-products are equipped with the chip manufacturer’s security and RF (high frequency) components. Low-noise preamplifi ers (LNA), antenna tuners, and RF switches increase transmission rates and decrease energy consumption. Furthermore, embedded secure element chips (eSE) protect the mobile devices’ security-critical functions. They ensure the secure transmission of sensitive data for contactless payments, enable comfortable biometric authentication for the user as well as new electronic ticketing solutions. This embedded-secure element is predominantly developed at Infineon’s development centre in Graz. It is a contact-based, highly secure chip with a 1.5 MB memory, which is a very high memory capacity for a semiconductor in this segment. TAKING THE LEAD IN THE MOBILE PAYMENT SECTOR Embedded-secure-elements are becoming the standard solution for NFC applications (near fi eld communication). Market researchers predict that the number of new smartphones with integrated NFC security elements will increase from currently 427 million to 1,620 million in 2020 (IHS, NFC Report 2015). Ease of use combined with security measures should increase the acceptance of mobile payment methods signifi cantly. Tomorrow’s technologies are created in Austria.
NEW BUSINESS - EXPORT TODAY 1/2016
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